Digi-Kom has a zero counterfeit tolerance policy and a very aggressive anti counterfeit program and takes quality very seriously. This is evidenced by our very low RMA rate – which is consistently below 1%, a very low rate considering many of our customers are utilizing our services to source obsolete, allocated and hard to source parts.
We understand that our customers need more than a supplier; they need a strategic partner in their supply chain, so we strive to be that and more.
Digi-Kom is ISO 9001:2008 certified for our quality management system & ANSI/ESD compliant.
All of our vendors are carefully screened prior to approval and given an ongoing performance analysis to determine their supplier rating. Our vendors must maintain an acceptable rating in our system in order to stay on our approved supplier list (ASL).
Upon receipt all parts undergo an extensive inspection process, in accordance with IDEA STD1005-D, microscopic visual inspection and a marking permanancy test. Any parts with noted non conformances are immediately quarantined.
Digi-Kom utilizes an INDEPENDENT testing facility for further analysis and screening including decapsulation for die analysis, HCT to test for remarking, and electrical testing Our Independent testing facility is certified ISO 9001:2008 and certified as meeting the requirements of AS9100-C.
The testing capabilities and procedures utilized include the following:
Visual Inspection
External visual inspection is a process of verifying the attributes of parts such as components condition, part markings, evidence of a secondary coating, lead conditions, dimensions and surface quality. Visual inspection is performed per SAE AS5553 and MIL-STD-883 Method 2009.9 and on a sample parts from a given lot. |
Decap or De-lid
Decapsulation is to chemically etch a device until the die is exposed. This is done with a Jet Etch system from Nisene Technology Group. Once exposed a device may be confirmed by reading the internal die markings under a microscope. In some events a die marking will correlate with a devices external markings. |
Heated Chemical
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XRF
XRF can be carried out on parts to evaluate the material composition of the terminations and the molding compound in order to detect the presence or absence of Pb and other discrepancies with an authentic part. This is a non-destructive test. A complete graph will be providing with a list of substances found. |
X-Ray Analysis
X-ray inspection is a non-destructive test. It is a process to verify the bond wire connections, die size comparison and ESD damaged. Our typical sample lot check is 5 samples or 100% depending customer requirement. Counterfeit devices can be determined by comparing the structure of the die to a known good device. Part should be identical from bond wire location to die size. |
Electrical Testing
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